M. Sc. Fabian Kempf
- 21.06.2024
- An Adaptive Multi-Core Architecture for Runtime-Configurable Redundancy in Mixed-Criticality Systems
- Group: Prof. Becker
Corrector: Prof. Dr.-Ing. Diana Göhringer (Technische Universität Dresden)
Runtime Adaptive Many-Core Architectures
Modern processors have to fulfill more and more conflicting requirements. Processors should not only become more and more powerful and efficient, but also more and more error-resistant. One solution to meet these conflicting requirements is adaptive processor architectures, which adapt to the requirements and the situation. Through adaptivity at runtime, the best compromise between the requirements can be achieved during operation.
Fault tolerance mechanisms based on adaptive hardware redundancy
With the increasing automation of driving, the risk of electronic malfunctions in the vehicle leading to physical damage is rising. In this context, relevant components must therefore increasingly be designed in such a way that they reliably provide a defined minimum level of functionality despite such malfunctions. This requires the use of suitable fault tolerance mechanisms. We are researching the particularly cost-effective implementation of such mechanisms using adaptive hardware redundancy.
Reliable AI accelerators in safety-critical environments
The basis for autonomous driving and other safety-critical applications is reliable perception of the near environment using cameras, as well as radar and lidar sensors. Machine learning, e.g. Convolutional Neural Networks, provide the best results for object detection. The current challenge is to integrate these neural networks into embedded systems while ensuring reliability. In particular, random hardware faults in AI accelerators as well as the inability of neural networks to estimate their own uncertainty still prevent safety-critical deployment
Supervised student works (selection)
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SA: “Fault Tolerance in Embedded Mixed Critical Systems”
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BA: “Concept and implementation of a dynamic lockstep architecture for a LEON3 Many-Core System”
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BA: “Concept and implementation of a cache-based fault-tolerant mechanism for the LEON3 processor”
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MA: “Concept and Implementation of an adaptive cache architecture for a LEON3 Many-Core System”
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MA: “Investigation of machine learning approaches for error detection in control flow based on bus snooping”
Publications
Hoefer, J.; Gauß, M.; Adams, M.; Kreß, F.; Kempf, F.; Karle, C.; Harbaum, T.; Barth, A.; Becker, J.
2024. 2024 IEEE International Symposium on Circuits and Systems (ISCAS), Singapore, Singapore, 19-22 May 2024, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ISCAS58744.2024.10557955
Kempf, F.; Hoefer, J.; Harbaum, T.; Becker, J.; Fasfous, N.; Frickenstein, A.; Voegel, H.-J.; Friedrich, S.; Wittig, R.; Matúš, E.; Fettweis, G.; Lueders, M.; Blume, H.; Benndorf, J.; Grantz, D.; Zeller, M.; Engelke, D.; Eickel, K.-H.
2023. 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), Antwerp, Belgium, 17-19 April 2023, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/DATE56975.2023.10137257
Kempf, F.; Höfer, J.; Hotfilter, T.; Becker, J.
2023. 2023 IEEE 16th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC), 276 – 283, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MCSoC60832.2023.00048
Hotfilter, T.; Hoefer, J.; Merz, P.; Kreß, F.; Kempf, F.; Harbaum, T.; Becker, J.
2023. 2023 IEEE 36th International System-on-Chip Conference (SOCC), Santa Clara, USA, 05-08 September 2023, 1–6, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC58585.2023.10256738
Kreß, F.; Pfau, J.; Kempf, F.; Schmidt, P.; He, Z.; Harbaum, T.; Becker, J.
2023. 2023 IEEE Nordic Circuits and Systems Conference (NorCAS), 31st October - 1st November 2023, Aalborg, Denmark, 1–7, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/NorCAS58970.2023.10305469
Hotfilter, T.; Höfer, J.; Kreß, F.; Kempf, F.; Kraft, L.; Harbaum, T.; Becker, J.
2023. 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS), 1–5, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/AICAS57966.2023.10168566
Kempf, F.; Becker, J.
2023. 2023 12th Mediterranean Conference on Embedded Computing (MECO), 1–5, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MECO58584.2023.10154986
Hoefer, J.; Kempf, F.; Hotfilter, T.; Kreß, F.; Harbaum, T.; Becker, J.
2023. Proceedings of the Great Lakes Symposium on VLSI 2023, 287–292, Association for Computing Machinery (ACM). doi:10.1145/3583781.3590226
Kempf, F.; Kühbacher, C.; Mellwig, C.; Altmeyer, S.; Ungerer, T.; Becker, J.
2023. 2022 25th Euromicro Conference on Digital System Design (DSD), 704–711, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/DSD57027.2022.00099
Kempf, F.; Höfer, J.; Kreß, F.; Hotfilter, T.; Harbaum, T.; Becker, J.
2022. Conference Proceedings: 2022 IEEE 35th International System-on-Chip Conference (SOCC) Ed.: S. Sezer, 1–6, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC56010.2022.9908110
Hotfilter, T.; Kreß, F.; Kempf, F.; Becker, J.; Baili, I.
2022. 2022 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Nicosia, Cyprus, 04-06 July 2022, 371–372. doi:10.1109/ISVLSI54635.2022.00082
Hotfilter, T.; Kreß, F.; Kempf, F.; Becker, J.; Haro, J. M. De; Jiménez-González, D.; Moretó, M.; Álvarez, C.; Labarta, J.; Baili, I.
2022. 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE), Antwerp, Belgium, 14-23 March 2022, 628–631, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/DATE54114.2022.9774716
Hotfilter, T.; Hoefer, J.; Kreß, F.; Kempf, F.; Becker, J.
2021. IEEE 34th International System-on-Chip Conference (SOCC), 14th-17th September 2021, Las Vegas, Nevada, USA, 83–88, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC52499.2021.9739212
Kempf, F.; Hartmann, T.; Bähr, S.; Becker, J.
2021. 2021 IEEE Computer Society Annual Symposium on VLSI (ISVLSI): 7-9 July 2021, Tampa, FL, USA, 7–12, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ISVLSI51109.2021.00013
Hotfilter, T.; Kempf, F.; Becker, J.; Reinhardt, D.; Baili, I.
2020. 6th IEEE World Forum on Internet of Things, WF-IoT 2020, New Orleans, United States, 2 - 16 June 2020, Art.Nr. 9221396, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/WF-IoT48130.2020.9221396
Reder, S.; Kempf, F.; Bucher, H.; Becker, J.; Alefragis, P.; Voros, N.; Skalistis, S.; Derrien, S.; Puaut, I.; Oey, O.; Stripf, T.; Ferdinand, C.; David, C.; Ulbig, P.; Mueller, D.; Durak, U.
2019. Journal of aerospace information systems, 16 (11), 521–533. doi:10.2514/1.I010749
Kempf, F.; Anantharajaiah, N.; Masing, L.; Becker, J.
2019. 32nd IEEE International System on Chip Conference, SOCC 2019; Singapore; Singapore; 3 September 2019 through 6 September 2019. Ed.: D. Zhao, 39–44, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC46988.2019.1570558594
Anantharajaiah, N.; Kempf, F.; Masing, L.; Lesniak, F. M.; Becker, J.
2019. Proceedings of the 12th International Workshop on Network on Chip Architectures (NoCArc 2019), Columbus, OH, Ocober 12-13, 2019, 1–6, Association for Computing Machinery (ACM). doi:10.1145/3356045.3360718
Baehr, S.; Kempf, F.; Becker, J.
2018. Proceedings of the 18th International Conference on Nanotechnology (IEEE-NANO 2018), Cork, IRL, July 23-26, 2018, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/NANO.2018.8626239
Baehr, S.; Kempf, F.; Becker, J.
2018. Proceedings of the 31th IEEE International System-on-Chip Conference (SOCC), Arlington, VA, September 4-7, 2018, 174–179, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC.2018.8618563