M. Sc. Florian Schade
- 10.06.2024
- Hypervisor-based Partitioning of Mixed-Criticality Applications in Heterogeneous Embedded Systems
- Group: Prof. Becker
- florian schade ∂ kit edu
Corrector: Prof. Dr.-Ing. Jürgen Fleischer (wbk Institut für Produktionstechnik, KIT)
Hypervisor-based software architectures for efficient mixed-criticality systems
Increasingly powerful processing platforms are leading to more centralized controller architectures in networked embedded systems as found in cars, aircraft or industrial production systems. Software-driven functions formerly realized on distributed processing units are integrated on few powerful machines. Hypervisors support this integration by managing the machine’s resources and isolating applications. However, In the context of safety and real-time systems, an efficient integration of mixed-critical software is difficult. Therefore, we research architectures and mechanisms to increase the efficiency of such platforms while still maintaining safety and timing guarantees.
Data processing in future industrial production systems
Future industrial production systems lead to new challenges concerning data processing and machine control. Focusing on flexibility and efficiency, KIT investigates a production system concept based on collaborating robots executing different manufacturing steps. During production robots exchange tools and switch between standalone and collaborative mode. An efficient control and data processing system is needed to orchestrate control and data processing software execution within a network of processing units, providing processing power as needed by the production system and ensuring real-time processing where necessary.
Supervised student works (selection)
- MA: „Architecture for the Integration of Reconfigurable Hardware Accelerators in Hypervisor-based Edge Devices“
- BA: „Development of a Resource Management Module for XEN Hypervisor Guest System Management“
- BA: „Automated Job Deployment for Reconfigurable Industry 4.0 Production Systems in Additive Manufacturing“
- MA: „Embedded Hypervisor Monitoring Using CPU Trace Information“
- BA: „Design of a Monitoring System for Hypervisor-Based Multiprocessor SoCs“
Publications
Schade, F.
2024, July 23. Karlsruher Institut für Technologie (KIT). doi:10.5445/IR/1000172536
Mühlbeier, E.; Bauer, V.; Schade, F.; Gönnheimer, P.; Becker, J.; Fleischer, J.
2024. 56th CIRP International Conference on Manufacturing Systems 2023 Hrsg.: Mpofu, Khumbulani; Sacks, Natasha; Damm, Oliver, 120, 744–749. doi:10.1016/j.procir.2023.09.069
Dörr, T.; Schade, F.; Becker, J.; Keramidas, G.; Petrellis, N.; Kelefouras, V.; Mavropoulos, M.; Antonopoulos, K.; Antonopoulos, C. P.; Voros, N.; Ahlbrecht, A.; Zaeske, W.; Janson, V.; Nöldeke, P.; Durak, U.; Panagiotou, C.; Karadimas, D.; Adler, N.; Reichmann, C.; Sailer, A.; et al.
2024. Design, Automation & Test in Europe Conference & Exhibition (DATE), Valencia, Spain, 25-27 March 2024, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/DATE58400.2024.10546852
Schade, F.; Dörr, T.; Ahlbrecht, A.; Janson, V.; Durak, U.; Becker, J.
2024. 2023 26th Euromicro Conference on Digital System Design (DSD), Golem, 6th - 8th September 2023, 436 – 443, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/DSD60849.2023.00067
Schade, F.; Kreutzer, M.; Mühlbeier, E.; Gerlitz, E.; Gönnheimer, P.; Fleischer, J.; Becker, J.
2023. Procedia CIRP, 120, 601–606. doi:10.1016/j.procir.2023.09.045
Dörr, T.; Schade, F.; Becker, J.
2023. Computer Safety, Reliability, and Security. Ed.: J. Guiochet, 181–195, Springer Nature Switzerland. doi:10.1007/978-3-031-40923-3_14
Dörr, T.; Schade, F.; Ahlbrecht, A.
2023, June 7. 4th Summer School on Cyber-Physical Systems and Internet-of-Things (CPS&IoT 2023), Budva, Montenegro, June 6–10, 2023
Schade, F.; Karle, C.; Mühlbeier, E.; Gönnheimer, P.; Fleischer, J.; Becker, J.
2022. Procedia CIRP, 107, 1311–1316. doi:10.1016/j.procir.2022.05.150
Dörr, T.; Schade, F.; Masing, L.; Becker, J.; Keramidas, G.; Antonopoulos, C. P.; Mavropoulos, M.; Kelefouras, V.; Voros, N.
2022. 2022 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Nicosia, Cyprus, 04-06 July 2022, 369–370, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ISVLSI54635.2022.00081
Dörr, T.; Schade, F.; Ahlbrecht, A.; Zaeske, W.; Masing, L.; Durak, U.; Becker, J.
2022. 2022 IEEE/ACM 26th International Symposium on Distributed Simulation and Real Time Applications (DS-RT), 151–159, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/DS-RT55542.2022.9932069
Schade, F.; Sandmann, T.; Becker, J.; Theiling, H.
2022. 2022 IEEE 28th International Conference on Embedded and Real-Time Computing Systems and Applications (RTCSA), Taipei, Taiwan, 23-25 August 2022, 228–234, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/RTCSA55878.2022.00031
Schade, F.; Dörr, T.; Becker, J.
2022. Conference Proceedings: 2022 IEEE 35th International System-on-Chip Conference (SOCC) Ed.: S. Sezer, 1–2, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC56010.2022.9908090
Siddiqui, F.; Khan, R.; Sezer, S.; McLaughlin, K.; Masing, L.; Dörr, T.; Schade, F.; Becker, J.; Ahlbrecht, A.; Zaeske, W.; Durak, U.; Adler, N.; Sailer, A.; Weber, R.; Wilhelm, T.; Nemeth, G.; Nemeth, G.; Morales, V.; Gomez, P.; Keramidas, G.; et al.
2022. 2022 IEEE 95th Vehicular Technology Conference: (VTC2022-Spring): Proceedings ; 19–22 June 2022, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/VTC2022-Spring54318.2022.9860859
Masing, L.; Dörr, T.; Schade, F.; Becker, J.; Keramidas, G.; Antonopoulos, C. P.; Mavropoulos, M.; Tiganourias, E.; Kelefouras, V.; Antonopoulos, K.; Voros, N.; Durak, U.; Ahlbrecht, A.; Zaeske, W.; Panagiotou, C.; Karadimas, D.; Adler, N.; Sailer, A.; Weber, R.; Wilhelm, T.; et al.
2022. 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE), Antwerp, Belgium, 14-23 March 2022, 814–818, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/DATE54114.2022.9774534
Albers, A.; Ovtcharova, J.; Becker, J.; Lanza, G.; Zhang, W.; Zhang, T.; Qiao, F.; Ma, Y.; Wang, J.; Wu, Z.; Ehrmann, C.; Gönnheimer, P.; Behrendt, M.; Mandel, C.; Stürmlinger, T.; Klippert, M.; Kimmig, A.; Schade, F.; Yang, S.; Heider, I.; et al.
2022. (J. Fleischer, Ed.), Karlsruher Institut für Technologie (KIT). doi:10.5445/IR/1000143693
Kimmig, A.; Schöck, M.; Mühlbeier, E.; Oexle, F.; Fleischer, J.; Bönsch, J.; Ovtcharova, J.; Hahn, J.; Grunwald, A.; Albers, A.; Rapp, S.; Hagenmeyer, V.; Scholz, S. G.; Schmidt, A.; Müller, T.; Becker, J.; Schade, F.; Beyerer, J.; Rehak, J.; Zwick, T.; et al.
2021. Zeitschrift für wirtschaftlichen Fabrikbetrieb, 116 (12), 935–939. doi:10.1515/zwf-2021-0207
Becker, J.; Masing, L.; Dörr, T.; Schade, F.; Keramidas, G.; Antonopoulos, C. P.; Mavropoulos, M.; Tiganourias, E.; Kelefouras, V.; Antonopoulos, K.; Voros, N.; Durak, U.; Ahlbrecht, A.; Zaeske, W.; Panagiotou, C.; Karadimas, D.; Adler, N.; Sailer, A.; Weber, R.; Wilhelm, T.; et al.
2021. Proceedings 2021 31st International Conference on Field-Programmable Logic and Applications: FPL 2021 ; Dresden, Germany, 30 August – 3 September 2021, 382–383, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/FPL53798.2021.00075
Schade, F.; Barton, D.; Fleischer, J.; Becker, J.
2021. 7th IEEE World Forum on Internet of Things (WF-IoT), 680–685, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/WF-IoT51360.2021.9595534
Gönnheimer, P.; Kimmig, A.; Mandel, C.; Stürmlinger, T.; Yang, S.; Schade, F.; Ehrmann, C.; Klee, B.; Behrendt, M.; Schlechtendahl, J.; Fischer, M.; Trautmann, K.; Fleischer, J.; Lanza, G.; Ovtcharova, J.; Becker, J.; Albers, A.
2019. Procedia CIRP, 84, 880–885. doi:10.1016/j.procir.2019.04.260
Yigui, L.; Youteng, S.; Schade, F.; Hotfilter, T.; Becker, J.; Yuan, Z.; Zizhou, O.; Weiming, L.
2019. Proceedings of the Institution of Mechanical Engineers / D, 233 (9), 2371–2378. doi:10.1177/0954407019851334
Barton, D.; Gönnheimer, P.; Schade, F.; Ehrmann, C.; Becker, J.; Fleischer, J.
2019. Procedia CIRP, 81, 1331–1336. doi:10.1016/j.procir.2019.04.022
Dörr, T.; Sandmann, T.; Schade, F.; Bapp, F. K.; Becker, J.
2019. Applied Reconfigurable Computing – 15th International Symposium, ARC 2019, Darmstadt, 9.-11. April 2019, 96–111, Springer. doi:10.1007/978-3-030-17227-5_8
Silitonga, A.; Schade, F.; Jiang, G.; Becker, J.
2018. Proceedings of the 16th IEEE International Symposium on Parallel and Distributed Processing with Applications (ISPA2018), Melbourne, Australia, 11th-13th December 2018, 1009–1016, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/BDCloud.2018.00147
Bapp, F. K.; Dörr, T.; Sandmann, T.; Schade, F.; Becker, J.
2018. SAE International. doi:10.4271/2018-01-1072