Successful participation of ITIV at the 37th IEEE SOCC
The 37th IEEE International System-on-Chip Conference (SOCC), which took place in Dresden from September 16 to 19, 2024, offered an exciting 3.5-day program with keynotes, tutorials, technical presentations and a poster session.
Dr. Tanja Harbaum, who acted as Technical Program Chair, and Prof. Jürgen Becker, who this time took on the role of Special Session Chair, represented ITIV at this renowned conference. The event provided a platform for leading experts and young scientists to present and discuss the latest developments and research results in the field of System-on-Chip (SoC).
This year, the SoC community focused on several important topics:
- Chip design for AI applications
- Edge computing and IoT
- Advanced packaging technologies
- Cybersecurity in embedded systems
Among the outstanding contributions were the 6 excellent keynote talks by renowned speakers from industry and academia:
This was complemented by a variety of presentations from young scientists, including from Prof. Becker's PhD group. Fabian Kreß, Marc Neu, Patrick Schmidt and Jann Krausse presented their current research results and thus also made a significant contribution to the scientific exchange.
In particular, the opening keynote talk by Prof. Norbert Wehn (RPTU Kaiserslautern) and the industrial keynotes by Harald Kröger (SiMa.ai) and Michael Schaffert (Robert Bosch GmbH) highlighted the crucial role of artificial intelligence and networked systems in the modern semiconductor industry worldwide.
The current cooperation between SiMa.ai and the KIT shows how innovative solutions can be developed and future specialists optimally trained through cooperation between industry and academic institutions.
With over 110 registered participants, the conference was very well attended. Events such as the IEEE SOCC are crucial for promoting innovation and collaboration. They provide a unique platform to share ideas, discuss industry challenges and shape the future of technology together.