Prof. Dr.-Ing. Markus Schinle
- Hochschule Offenburg
- Digital health applications
- Phone: +49 721 9654-756
- schinle ∂does-not-exist.fzi de
Data-driven development of digital health applications
Engineering is playing an increasingly important role in the development of future precision medicine, which aims to enable personalized care and increase the efficiency of healthcare systems. Digital health applications are an essential part of this, as they form the basis for data-driven development. In our research, we investigate which methods and tools are necessary to support the development of such applications and develop a framework based on a combination of data-driven and knowledge-based development. With this approach, we want to help shape the future of healthcare and improve the quality of life of patients worldwide. How the necessary methods and tools need to be designed is developed in our research in collaboration with various experts. As a prospective engineer, you have the opportunity to help shape these future technologies and make a valuable contribution to society.
Digital platforms for the treatment of risk factors in neurodegenerative diseases
As part of our research projects, a digital platform is being developed to enable low-threshold access to individualized treatment strategies for neurodegenerative diseases in an outpatient setting. Using digital methods and mobile sensor technologies to control risk factor-based intervention strategies, this treatment process is integrated into a mobile support solution and accompanied by various tools. The aim is to develop applications that are integrated into a platform for the treatment of specific risk factors for dementia. You may be responsible for the design and development of different aspects of the platform.
Translation and scaling of digital health applications
Scaling digital health applications requires a multi-faceted approach that includes stakeholder collaboration, regulatory compliance, integration with existing healthcare systems, customization and personalization, and continuous evaluation and improvement. By implementing these strategies, business models for digital health applications can be successfully established and scaled to have a significant impact on improving healthcare outcomes. Make it your mission to find out how this can be done in the context of specific use cases in the German healthcare system!
| Titel | Type |
|---|---|
| Translational research for the scaling of digital health applications | Bachelorarbeit |
| Platform for the treatment of risk factors in dementia | Bachelor- / Masterarbeit |
| Model-based approaches for recording patient reports (Patient Reported Outcome) | Bachelor- / Masterarbeit |
| Gamification for lifestyle interventions | Masterarbeit |
| Gamification for lifestyle interventions | Bachelorarbeit |
| Translational research for the scaling of digital health applications | Masterarbeit |
| METIS NEUROTEC - Fighting dementia with AI | Bachelor-/ Masterarbeit |
| Title | Starting date |
|---|---|
| Translational research for the scaling of digital health applications | ab 09 / 2024 |
| Platform for the treatment of risk factors in dementia | ab 09 / 2024 |
| Model-based approaches for the collection of patient reports (Patient Reported Outcome) | ab 09 / 2024 |
| Gamification for lifestyle interventions | ab 09 / 2024 |
Publications
Zhou, K.; Schinle, M.; Stork, W.
2023. Methods, 218, 224–232. doi:10.1016/j.ymeth.2023.08.014
Stock, S.; Hausberg, J.; Armengol-Urpi, A.; Kaufmann, T.; Schinle, M.; Gerdes, M.; Stork, W.
2023. 2023 IEEE Conference on Computational Intelligence in Bioinformatics and Computational Biology (CIBCB), Eindhoven, Netherlands, 29-31 August 2023, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/CIBCB56990.2023.10264876
Schinle, M.; Dietrich, M.; Stock, S.; Gerdes, M.; Stork, W.
2023. Caring is Sharing. Ed.: M. Hägglund, 937–941, IOS Press. doi:10.3233/SHTI230313
Zhou, K.; Schinle, M.; Weimar, S.; Gerdes, M.; Stock, S.; Stork, W.
2023. 2022 IEEE International Conference on Bioinformatics and Biomedicine (BIBM), 1435–1442, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/BIBM55620.2022.9995577
Otake, M.; Kilimann, I.; Schinle, M.; Kumagai, K.; Weimar, S.
2023. (S. Stock, Ed.), KITopen
Stock, S.; Schinle, M.
2023, June 21. 2nd International Forum on Neural Engineering & Brain Technologies (2023), Berlin, Germany, June 20–21, 2023
Schinle, M.
2022, September 8. Karlsruher Institut für Technologie (KIT). doi:10.5445/IR/1000150345
Schinle, M.; Erler, C.; Kaliciak, M.; Milde, C.; Stock, S.; Gerdes, M.; Stork, W.
2022. JMIR Formative Research, 6 (6), Art.-Nr.: e35961. doi:10.2196/35961
Stock, S.; Gerdes, M.; Schinle, M.; Veloso de Oliveira, J.; Hauptmann, L.; Martini, L.; Stork, W.
2021. Investigative Ophthalmology & Visual Science, 62 (8), 2391–2391
Schinle, M.; Erler, C.; Leenstra, S.; Stock, S.; Gerdes, M.; Stork, W.
2021. 2021 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME), 1–6, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICECCME52200.2021.9591139
Stock, S.; Mazura, F.; De La Torre, F. G.; Gerdes, M.; Schinle, M.; Stork, W.
2021. 2021 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME), 01–06, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICECCME52200.2021.9590972
Schinle, M.; Erler, C.; Schneider, T.; Plewnia, J.; Stork, W.
2021. 2021 IEEE International Symposium on Medical Measurements and Applications (MeMeA) : 2021 IEEE International Symposium on Medical Measurements and Applications, MeMeA 2021, Virtual, 23 June 2021 - 25 June 2021, Art.-Nr.: 9478676, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MeMeA52024.2021.9478676
Schinle, M.; Erler, C.; Stork, W.
2021. Proceedings of the 54th Hawaii International Conference on System Sciences, 3972–3981. doi:10.24251/HICSS.2021.482
Schinle, M.; Erler, C.; Andris, P. N.; Stork, W.
2020. 2nd Conference on Blockchain Research and Applications for Innovative Networks and Services, BRAINS 2020, Paris, France, 28 - 30 September 2020, 63–70. doi:10.1109/BRAINS49436.2020.9223283
Lucking, M.; Manke, R.; Schinle, M.; Kohout, L.; Nickel, S.; Stork, W.
2020. 2020 International Conference on Omni-layer Intelligent Systems (COINS), August 31 - September 2, 2020, Barcelona, Spain, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/COINS49042.2020.9191653
Schinle, M.; Erler, C.; Vetter, A. R.; Stork, W.
2020. 2020 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPS), Oxford, United Kingdom, 3-6 Aug. 2020, 153–158, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/DAPPS49028.2020.00020
Schinle, M.; Erler, C.; Stork, W.
2020. 53rd Hawaii International Conference on System Sciences (HICSS 2020), Grand Wailea, HI, January 7-10, 2020
Schinle, M.; Papantonis, I.; Stork, W.
2018. 2018 IEEE Sensors Applications Symposium (SAS), Seoul, March 12-14, 2018, 1–6, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SAS.2018.8336724
Schinle, M.; Wyszka, D.; Schwärzler, F.; Volz, K.; Ruby, M.-A.; Sejdinovic, E.; Stork, W.
2018. 13th IEEE International Symposium on Medical Measurements and Applications, MeMeA 2018; Universita La SapienzaRome; Italy; 11 June 2018 through 13 June 2018, Art. Nr.: 8438761, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MeMeA.2018.8438761
Schinle, M.; Schneider, J.; Blocher, T.; Zimmermann, J.; Chiriac, S.; Stork, W.
2017. MobileCloud 2017 : 5th IEEE International Conference on Mobile Cloud Computing, Services, and Engineering 2017, San Francisco, California, USA, 6th - 8th April 2017, 153–156, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MobileCloud.2017.20
Blocher, T.; Schneider, J.; Schinle, M.; Stork, W.
2017. 12th IEEE Sensors Applications Symposium, SAS 2017; Rowan University201 Mullica Hill RoadGlassboro; United States; 13 March 2017 through 15 March 2017, Art. Nr.: 7894052, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SAS.2017.7894052